S1-500D
- Synchronized 2D+3D inspection
- 30-second modeling from one sample
- Zero escape · 99%+ accuracy
- Inline SMT system
Inspection · 3D AI AOI Equipment · 3D EQUIPMENT
2D+3D in syncmicron-level 3D inspection.
DaoAI 3D AI-AOI Equipment — 2D appearance + 3D height / coplanarityin synchronized inspection. The flagship S1-500D models from one good sample in 30 seconds — zero escape, 99%+ accuracy, powered by the AI AOI software system.
SOVEREIGN AI VALUE
Your process know-how never leaves your line.
Yield curves, defect signatures, process parameters — this is a factory's core trade secret. Under IDC's framework, 3D AI AOI hardware starts with data sovereignty: fully on-prem deployment, with point-cloud data, results and model weights never leaving your site or training any third-party model.
- Process parameters stay yours
Good-sample templates and defect libraries are decades of production know-how — we help you use it, never help anyone else learn it.
- <12ms edge inference, works offline
Core inspection logic runs on the line itself, independent of external networks or cloud availability.
- A model that only gets smarter for you
Line feedback keeps refining your own private model — the edge you build stays yours, not a shared foundation.
FLAGSHIP · S1-500D
DaoAI S1-500D · Inline SMT AOI
View details
Zero escape · synchronized 2D+3D · 30-second modeling from one sample · 99%+ accuracy
2D+3DIn syncAppearance + height in one inspection
30sModel from one good sample
0missed escapesNo critical defect slips through
99%+detection accuracy
µm-level3D height precision
InlineSMTInline-cadence inspection
P3D
- 20MP(10µm) + 3D
- Max board 500 × 325 mm
- Dual-track conveyor · dual-line parallel
- High-volume 2D+3D inspection
SAI3D-470
- Synchronized 2D + 3D
- Multi-part < 1s · 99.97% detection
- Assembly height / coplanarity
- Mis/missing parts / positional deviation
3D Defect Types · 3D DEFECTS
TombstoneLifted LeadCoplanarityInsufficient solderExcess solderHeight deviationBGA void3D misalignmentComponent float heightWarpage
Model Specs · 3D Series SPECS
| Spec | S1-500D | P3D | SAI3D-470 |
|---|---|---|---|
| Form | Inline · all-in-one system | Inline · dual track | Assembly inspection |
| Inspection dimensions | 2D + 3D in sync | 2D + 3D | 2D + 3D |
| Modeling | One good sample · 30s | Sample-based modeling | Sample-based modeling |
| Max board size | 500 × 325 mm | 500 × 325 mm | 470 × 330 mm |
| Best for | Inline SMT full-board | High-volume dual-line | Assembly / multi-part inspection |
Common specs · 3D height imaging · multispectral RGB / coaxial lighting · micron-level 3D precision · powered by the AI AOI software system · 100% on-premise
WHY DAOAI
We build our own 3D cameras —
not a rebadged third-party module.
Most "3D AOI" systems on the market bolt a third-party structured-light or ToF module onto a generic algorithm. DaoAI's 3D camera is proprietary — built in-house from sensor calibration through 3D reconstruction and point-cloud algorithms, full stack. That's what makes 0-miss detection possible on 2D-blind-spot defects like hidden solder joints, coplanarity, micron-level topology, and voids.
Sensor and algorithm developed together — calibration precision and iteration speed aren't gated by a third-party module's supply cycle.
2D-3D fusion is designed in from the ground up, not two systems bolted together as a "fake fusion."
APPLICATIONS
3D solder volume, coplanarity, tombstone and lift inspection of solder joints.
BGA / CSP voids, ball height and coplanarity.
Zero-escape high-reliability soldering and 3D dimensions.
3D verification of assembly height, clearance and positional deviation.
FAQ
What is the accuracy of the 2D+3D synchronous micron-level 3D detection of DaoAI?
DaoAI's detection has micron-level 3D height accuracy. The flagship S1-500D achieves 0 missed detections and an accuracy rate of over 99%. The assembly model SAI3D -470 has a detection rate of 99.97%, accurately detecting various defects.
What scenarios are suitable for this set of detection products?
It is suitable for multiple industries, such as 3D solder volume detection of high-end PCBA solder joints, relevant detection of BGA/CSP in semiconductor packaging, high-reliability welding detection in automotive electronics, and 3D verification of precision assembly.
How to deploy DaoAI's detection equipment?
DaoAI's detection equipment adopts 100% local deployment, equipped with an AI AOI software system. It can ensure data security and stable operation, providing reliable industrial quality inspection solutions for enterprises.
Is DaoAI's 3D camera developed in-house, or sourced from a third-party module?
In-house. DaoAI's 3D camera is built full-stack in-house, from sensor calibration through 3D reconstruction and point-cloud algorithms — not a third-party structured-light/ToF module bolted onto a generic algorithm. That's the key to achieving 0-miss detection on 2D-blind-spot defects like hidden solder joints, coplanarity, and micron-level topology.
The Q&A above was generated with AI assistance and is for reference only; official specifications and commitments are subject to direct consultation.