Semiconductor / Chips · APPLICATION SCENARIO
During packaging, particles and scratches on the wafer surface vary widely in form — a frequent source of yield-affecting defects.
Scenario · Wafer Surface: Scratches / Particles / Chipping
Challenge & Solution
ChallengeTraditional inspection missed up to 3% of defects with a 20% false-positive rate, and every changeover required 30+ minutes of manual tuning.
SolutionVision foundation model plus APDT positive/few-shot learning: 1–20 good samples enable zero-code modeling in 5 minutes.
Recommended equipment: 3D AI AOI · AOI Software
View full case study → AI Vision Inspection Results for Particle and Scratch
This article was generated by AI. Customer cases are simulated scenarios based on real product capabilities and figures are illustrative; see product pages for official benchmarks.
FAQ
Traditional inspection missed up to 3% of defects with a 20% false-positive rate, and every changeover required 30+ minutes of manual tuning.
Vision foundation model plus APDT positive/few-shot learning: 1–20 good samples enable zero-code modeling in 5 minutes.
In real production deployments, Detection rate reaches 99.2%, False positive rate reaches -85%, and Missed detection rate reaches <0.8% (case studies are simulated scenarios based on real product capabilities; see product pages for official benchmarks).
Wafer Surface Particle & Scratch Classification pricing depends on production-line scale, number of inspection points, and deployment mode (cloud/edge/on-premise); configurations vary significantly by customer, so we don't publish a fixed price list. Book a demo for a quote and implementation timeline tailored to your setup.